Embeddable accelerometer pellets for OEM condition monitoring
Embeddable accelerometers from PCB®/IMI: OEM‑ready vibration sensing for wireless, battery‑powered and high‑volume products

When you need reliable vibration or shock data inside compact, battery‑powered or high‑volume products, PCB’s embeddable accelerometers give you the sensing core without the bulk of a traditional industrial housing. Available in charge mode, two‑wire ICP®, and MicroPower (3‑wire) ICP® variants, they balance bandwidth, noise, and power draw for everything from wireless condition monitoring to impact/shock detection.
Where embeddable sensors fit:
- Wireless and battery-powered IoT nodes — months or years of operation with ultra-low current draw, ideal for motors, pumps, fans, and other rotating equipment
- High-volume industrial OEMs — integrate directly on a PCB or within a small cavity using adhesive or header pins; targets include gear and bearing monitoring, machine protection, and logging of shock events
Why choose embeddable pellets ?
When your product needs better vibration data than MEMS can deliver
For many OEM monitoring products, the limiting factor is not the algorithm—it’s signal integrity. Embeddable pellet accelerometers use piezoelectric sensing with the sensing element positioned at the base, improving coupling to the measured surface and helping minimise unwanted vibration artefacts versus typical MEMS integration approaches.
Use cases
- Bearing condition trending (inboard/outboard)
- Gear mesh vibration / gearbox diagnostics
- Shock / impact event detection
- Integrated sensing points in machine modules (motor, pump, fan, compressor)
Built for OEM integration
- Mounting flexibility
Mount via adhesive or soldering, depending on mechanical design and production flow. - Connection styles
Options including integral cable or solder-pin connections for compact assemblies and repeatable builds. - Sensitivity choices
A range of sensitivities to match your vibration levels, bandwidth, and diagnostic targets.
If you already have your own signal conditioning electronics, charge mode variants can be an efficient, cost-focused route.
Technology options
Charge‑mode embeddable accelerometers — minimum electronics, maximum flexibility
Piezoelectric sensing elements that output charge (pC/g). You add the external charge amplifier/AFE on your board. Lowest sensor‑side power (none), high temperature tolerance and excellent high‑frequency capability; great when you control the analogue front‑end.

Example: Model 66192CPZ1 — TO‑5 header, ~5 pC/g, wide bandwidth.
Two‑wire ICP® embeddable accelerometers – simplicity with built‑in conditioning
Piezoelectric sensors with integrated electronics, powered over the same two wires that carry the signal. Drop‑in ease, wide industrial compatibility, and robust vibration performance without designing your own charge amplifier.
Example: Model 66212APZ1 — 100 mV/g, 0.5–10 kHz (±3 dB), TO 5 header pins; simplest drop in two wire ICP® embeddable accelerometer.
MicroPower (3‑wire) ICP® embeddable accelerometers — battery‑life optimised

Ultra‑low‑power ICP® designs with separate power/ground and signal lines, engineered for battery‑powered run‑time. Operate from low voltage with hundreds of microamps per channel while maintaining ICP® accuracy—ideal for wireless/IoT devices.
Quick selector
| Technology | Output type | Power / supply | Typical current | Indicative bandwidth (±3 dB) | Sensitivity options | Interface | Best for |
| Charge‑mode (Series 660) | Charge (pC/g) | No sensor power (external charge amp) | N/A | Up to ~10–12.5 kHz (model‑dependent) | e.g., ~5 pC/g variants | Charge amplifier / AFE | Highest HF; you own the analogue front‑end |
| Two‑wire ICP® | ICP® voltage | Constant‑current with ~18–28 V compliance | ≈2–4 mA per chan. | Up to ~10–12.5 kHz (model‑dependent) | 50–100 mV/g typical | Standard ICP® (2‑wire) | Fastest integration; proven interface |
| MicroPower (3‑wire) ICP® | ICP® voltage (separate power/signal) | Low‑voltage, ≈3–5 V | ≈hundreds of µA per chan. | Up to ~12.5 kHz (model‑dependent) | 50 or 100 mV/g typical | 3‑wire ICP® (power, ground, signal) | Battery‑powered IoT nodes; long run‑time |
Where customers embed pellets today
Customers are embedding these sensors to provide:
- Diagnostic data for bearing and gearbox health
- Compact vibration sensing inside machine housings where standard industrial accelerometers do not fit
- Shock monitoring in logistics, packaging, or sensitive component assemblies
Discuss your OEM integration
Tell us your application (bearing/gearbox/shock), mounting constraints, expected vibration levels, temperature range, and whether you need wired or battery-powered operation.



